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HomeWelding & SolderingKELLYSHUN new lead-free, high, medium and low temperature solder paste 138℃ patch BGA mobile phone repair welding tin planting S

Everythin345Archies™KELLYSHUN new lead-free, high, medium and low temperature solder paste 138℃ patch BGA mobile phone repair welding tin planting S

$19.99 USD$33.99 USD

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Your good friend! Please don't compare prices with others because we produce different materials (so only high quality products). The price is slightly more expensive, but the quality is guaranteed!

All products comply with ROHS REACH testing.
 
LF999/Sn42Bi58：Lead-free low temperature solder paste，Melting point: 138°C   LED type special non-high temperature resistant board is used, general products are not recommended.
 
LF666 Sn64Bi35Ag1: Lead-free medium-temperature solder paste, melting point: 183°C, suitable for non-high-temperature resistant boards. Products with high strength requirements are not recommended.
 

LF988 Sn99Ag0.3Cu0.7:Lead-free high-temperature solder paste, melting point: 217°C, suitable for normal circuit board welding, most widely used in SMT process, strong and strong.

 

KL558: Environmentally friendly halogen-free flux:

suitable for repairing all types of circuit boards, and has the best effect on repairing digital mobile phones. High SIR resistance will not cause two repairs.

 

2015 Tin Absorbing Tape: It has the characteristics of strong tin absorbing ability and no residue.

 

How to use?  The board should be preheated before use, so that the solder paste will be smoother

It can be stored at room temperature, and can be stored for a longer time under refrigeration conditions of 0-10 degrees Celsius,If refrigerated, take out an hour before use.

 
 

If you have not received the product for a long time, it may be that the goods were lost in transit, you can contact customer service for consultation, we will give you a refund or resend a new one

 
 

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